دانلود کتاب Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–21, 1964

فهرست مطالب :

Front Matter....Pages i-vi
Encapsulants for Electronic Packaging....Pages 1-12
Use of Radiation-Cross-Linked Materials for Encapsulating and Terminating Devices....Pages 13-20
Encapsulating with Loose Microballoons....Pages 21-27
Packaging Concept for a Miniature Low-Light-Level TV Camera....Pages 28-42
The Heat-Sink Module....Pages 43-57
Producibility Norms for Electronic System Packaging....Pages 58-62
Development of Packaging Techniques for a 960-Bit Plated-Wire Memory....Pages 63-71
Packaging Computer Circuitry for Space Applications—A Two-Part Compendium....Pages 72-86
A Cost and Performance Analysis of Encapsulation by Transfer Molding....Pages 87-97
Packaging of Miniature Diode Assemblies....Pages 98-105
Transfer Molding of Silicone Compounds for Environmental Protection of Electronic Modular Systems....Pages 106-118
A Feasibility Study in Miniaturized Packaging....Pages 119-132
Interconnection and Organization of Functional Electronic Blocks....Pages 133-140
Designing for Multilayer Circuits....Pages 141-156
A Flexible Module Concept for Electronic Box Design....Pages 157-164
A High-Frequency Multiple-Signal-Conductor Transmission Line....Pages 165-177
High-Frequency Interconnections....Pages 178-187
Interconnection System....Pages 188-200
Substitution of a Printed Conductor Ring Harness for a Conventional Cable Harness on the Mariner Series Spacecraft....Pages 201-213
Design of Connectors for Electronic Packaging....Pages 214-225
Mechanical and Electronic Packaging for a Launch-Vehicle Guidance Computer....Pages 226-241
Standard Package for Microcircuits....Pages 242-248
Semiconductor Circuits and Modular Packaging....Pages 249-265
A Packaging Evaluation of a Five-Bit Adder....Pages 266-277
Radiation Effects in Epoxies Used as Encapsulants for Electronic Packages....Pages 278-283
Designing a High-Voltage Power Supply for a Space Radar System....Pages 284-297