دانلود کتاب Ic Fabrication Technology [Paperback]

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Title Contents 1. Overview of Metal-Oxide-Semiconductor (MOS) Transistor 1.1 Introduction 1.2 Moore’s Law 1.3 Future Sizes of a Transistor and a Chip 1.4 Physics of Silicon 1.5 Silicon Devices 1.6 MOS Transistor Summary References Multiple-Choice Questions Descriptive Problems 2. Silicon Wafer Preparation for MOS Transistor Fabrication 2.1 Introduction 2.2 Silicon Crystal Structure 2.3 Defects in a Silicon Crystal 2.4 Single Crystalline Silicon-Wafer Fabrication for MOS Transistor Applications 2.5 Fabrication of Silicon Wafer from the Boule 2.6 Specifications of the Silicon Wafer 2.7 Defects and Impurities in the Silicon Wafer 2.8 Wafer Contaminations Summary References Multiple-Choice Questions Descriptive Problems 3. MOS Transistor Process Flow 3.1 Introduction 3.2 MOS Transistor Fabrication 3.3 Device Isolation 3.4 CMOS Fabrication Summary References Multiple-Choice Questions Descriptive Problems 4. Oxidation 4.1 Introduction 4.2 Structure of Silicon Dioxide 4.3 Oxidation Equipment and Process 4.4 Kinetics of Oxidation 4.5 Comment on the Deal-and-Grove Oxidation Model 4.6 Oxide Charges 4.7 Silicon Oxide Characterisation 4.8 Electrical Characterisation of MOS Capacitance 4.9 Case I: Non-Ideal Case 4.10 Case II: Ideal Case 4.11 Procedure of Oxide and Oxide/Silicon Interface Charge Measurements 4.12 Oxide Breakdown Measurements 4.13 Other Silicon Oxidation Techniques Summary References Multiple-Choice Questions Descriptive Problems 5. Mask 5.1 Introduction 5.2 Properties of Masks 5.3 Types of Masks and Mask Fabrication Techniques Summary References Multiple-Choice Questions Descriptive Problems 6. Lithography 6.1 Introduction 6.2 Photolithography Process 6.3 Photoresist 6.4 Non-Photoresist (Resist) 6.5 PR Cleaning Procedure 6.6 Light Source and the Optical Exposure System 6.7 Pattern Transferring Techniques and Mask Aligner 6.8 Optical Projection Lithography Technique 6.9 Non-Optical Projection Lithography Technique 6.10 Ion-Beam Lithography Summary References Multiple-Choice Questions Descriptive Problems 7. Etching 7.1 Introduction 7.2 Etching Techniques 7.3 Wet Etching of Common Films 7.4 Plasma Etching (Dry Etching) 7.5 Plasma Etching Mechanisms and Etching Modes 7.6 Plasma Etching Parameters Summary References Multiple-Choice Questions Descriptive Problems 8. Diffusion 8.1 Introduction 8.2 Diffusion Equipment and Process 8.3 Diffusion Models 8.4 Modification of Fick’s Law 8.5 Oxidation Effects on Diffusion Summary References Multiple-Choice Questions Descriptive Problems 9. Ion-Implantation 9.1 Introduction 9.2 Ion-Implantation Equipment 9.3 Ion-Implantation Parameters 9.4 Parameters Affecting the Dose and Uniformity 9.5 Advantages of Ion-Implantation 9.6 Disadvantages of Ion-Implantation 9.7 Ion-Implantation Model 9.8 Ion Stopping 9.9 Ion Channelling 9.10 Annealing Summary References Multiple-Choice Questions Descriptive Problems 10. Thin Film Deposition 10.1 Introduction 10.2 Film-Deposition Techniques 10.3 Metal Wirings and Contacts 10.4 Metal Film Deposition Techniques 10.5 Metal Alloy Deposition 10.6 Nitride Deposition 10.7 Silicide Deposition 10.8 Dielectric Deposition 10.9 Silicon Deposition 10.10 Film Thickness Measurements Summary References Multiple-Choice Questions Descriptive Problems 11. ULSI (nano) Fabrication 11.1 Introduction 11.2 Dielectric Film Deposition 11.3 Lithography 11.4 Etching Summary References Index