دانلود کتاب Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)

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Cover Half Title Series Title Copyright Contents Preface Author Biographies Chapter 1 Introduction Electronics in Space The Importance of the Electronic Packaging Engineer Baked-in Reliability Chapter 2 New Space Focus on Reliability Focus on Repeatability Focus on ROI (Return on Investment) Chapter 3 Thermal/Structural Challenges in Miniaturizing An Assessment of SpaceVNX by JPL Electronics Packaging Group Chapter 4 Fundamentals of Heat Transfer by Conduction and Convection Introduction Conduction Heat Transfer Convective Heat Transfer Chapter 5 Fundamentals of Heat Transfer by Radiation Introduction Blackbody Radiation Emissivity Absorptivity Reflectivity Gray Surfaces Diffuse Surfaces Radiation Geometry Chapter 6 The Multilayer Insulation (MLI) Blanket Blanket Applications Design (Driven by Requirements and Considerations) Chapter 7 Heat Pipes Variable Conductance Heat Pipes (VCHPs) Cryogenic Switching Heat Pipes (CSHPs) Water Sintered-Copper Heat Pipes Nano Heat Pipes (NHPs) Testing I. Introduction II. Analysis of Heat Pipe Failure B. Wick Failure C. 1D Heat Transfer Models Testing Freeze/Thaw Test Results Conclusion Future Work Acknowledgement Phase Change γ-Alumina Aqueous-Based Nanofluid for Improving Heat Pipe Transient Efficiency (The Nano Heat Pipe) Summary and Conclusions Chapter 8 Convective Cooling of Semiconductors Using a Nanofluid Introduction Forced Convection Flow Nanofluids for Cooling Electronics Nanoscale Thermal Interface Test Vehicle Design Experimental Setup Summary and Conclusions Acknowledgement Chapter 9 Power Systems: The Tesla Turbine Introduction Arriving at a Closed-Form Solution Case Study, an Automotive Air Conditioner Chapter 10 Electronics Design for Extreme Temperature and Pressure Chapter 11 Characterization and Modeling of PWB Warpage and Its Effect on LGA Separable Interconnects Introduction Method of Investigation Results Conclusion Acknowledgements Chapter 12 Resistor Networks Conduction Chapter 13 Thermal Analysis Case Studies Introduction to the Case Studies Subject: Thermal Analysis of Scanner Demodulator Electronics (SDE) for SHERLOC Subject: SHERLOC Laser Power Supply Transient Thermal Analysis Detailed Mode (100 Spectra) U1—Thermal Strap Thermal Analysis at 55 °C Boundary Temperature Subject: Universal System Transponder (UST) Thermal Analysis Subject: Preliminary Power Switch Slice (PSS) Assembly Thermal Analysis Chapter 14 Random Vibration Structural Analysis and Miles' Equation Introduction Limiting Factors Load Modal Response Relative Displacement Model Acceleration Response Relative Displacement and Spring Force RMS and Standard Deviation Chapter 15 Vibrational Analysis Case Studies Introduction to the Vibrational Case Studies Subject: Photodiode Board Assembly Structural Analysis Subject: Sine Vibration Analysis of HRMR DDU for Sentinel-6 Subject: Laser Power Supply (LPS) Structural Analysis Chapter 16 Creep Prediction of a Printed Wiring Board for Separable Land Grid Array Connector Introduction Mechanical Scheme Prediction of Long-Term Creep Experimental Setup Results Summary and Conclusion Chapter 17 Operational Case Studies—Mars Surface Operations MSL Rear Hazcam Thermal Characterization I. Introduction II. Description 1. Engineering Cameras 2. Rear Hazcam Environment 3. Model Description III. Testing of the Rear Hazcam on Mars Hazcam Thermal Characterization and the ECAM Calculator IV. Results A. Hazcam Telemetry vs. ECAM Calculator B. Model Prediction vs. Telemetry V. Conclusion VI. Future Work VII. Acknowledgement Laser Power Supply Thermo-Structural Analysis for the Mars 2020 Rover Introduction Design Consideration: Thermal and Electrical Isolation Materials Thermal Results Transient Thermal Analysis Steinberg Fatigue Analysis Chassis Fasteners Venting Analysis Conclusion Acknowledgement Chapter 18 Operational Case Studies—Dawn Asteroid Mission Introduction Thermal Design Based on Flight Proven Thermal Control Techniques Operation Chapter 19 Standards 1.0 Structural Design and Test Requirements (NASA-STD-5001) [1] 2.0 Derating Standards ECSS-Q-ST-30–11-REV1 Derating EEE Components, Page 40 [2] 3.0 GEVS NASA-STD-7000A[3] 4.0 SMC-160 [4] 5.0 Bolt Thermal Resistances—Spacecraft Thermal Control Handbook [5] Index